Hearing this question, Gao Nian explained without hesitation:
"The chip uses the CMOS process, which is mainly based on lithography machines.
That is, tiny transistors are carved on a whole wafer, and then elements are doped into the transistor to form the corresponding transistor. Finally, the transistors are connected by wire harnesses to form an integrated circuit.
Among them, don't look at how thick the chips we get are, but they are actually very thin, because the core transistor layer is only that thin layer.
The 3D chip stacking technology is to add a layer on the volume of the same chip through clever design to form a two-layer or even multi-layer structure.
Thereby, twice or even several times the number of transistors can be stuffed into the same chip volume, and the performance can be improved directly by stacking the number of transistors.
Of course, the more layers the chip is stacked, the higher the heat generation of the chip will be, so there is a limit to the number of layers that can be stacked, and it cannot be stacked too much."
"I see."
After hearing Gao Nian's explanation, the people present instantly lit up, feeling that this 3D chip stacking technology is simply a super black technology.
After all, the original chip was only a single-layer structure. Now that two chips are stacked together, the number of transistors is indeed doubled out of thin air.
Although the price is that the heat generation may be doubled, and the computer may be higher, the performance improvement brought by doubling the number of transistors is quite huge.
So this is a super black technology.
The people present couldn't help but start to imagine the prospects after the application of this black technology.
"When can we develop such technology? How long will it take?"
Gao Peng couldn't help but ask.
"We haven't officially started researching this technology. Currently, this 3D chip stacking technology is just a technical development concept in my mind.
As for the specific landing time, I will fully participate in this project, and it will probably be completed in half a year."
Gao Nian said, causing the people present to frown slightly, feeling a little regretful.
They didn't expect that this 3D chip stacking technology is currently just a technical development concept in Gao Nian's mind.
Although Gao Nian said that he would fully participate in the research and development, they still couldn't help but maintain a certain degree of doubt as to whether the 3D chip stacking technology could be developed within half a year.
After all, on the surface, this is just to stack two 'chips' together, which doesn't seem to be a problem on the surface.
But in fact, if this technology is so easy to do, companies all over the world would have already initiated research and development projects on this technology. After all, stacking two or even multiple layers of transistors together, and then doubling or even multiplying the number of chip transistors, is a great idea.
They believe that Gao Nian is not the only one who can think of this. So many chip practitioners and chip designers around the world must also be able to think of this excellent idea.
But now, decades have passed, and there is still no 3D chip stacking technology, which shows that the technology of stacking multiple chips together must be very difficult.
Or the cost is very high, which makes chip manufacturers uninterested in this technology development line.
However, no matter what expressions the people present had, Gao Nian had already decided to fully research and develop 3D chip stacking technology.
After all, chips are the absolute lifeblood of Geek Technology. If TSMC does not provide Geek Technology with 28nm process chips.
Then Geek Technology's computer and mobile phone business can directly announce its demise.
Therefore, Geek Technology must prepare in advance and cannot wait until the headache is treated when the head hurts, and the foot is treated when the foot hurts.
So, in this way, Gao Nian made many arrangements next, making Geek Technology busy. Among them, SMIC International is naturally the top priority.
Therefore, Geek Technology will continue to take out a large amount of funds to invest in SMIC International, and even directly acquire and control SMIC International, so that they can work hard to develop the next generation of 28nm process technology.
Of course, companies that develop chip production equipment, such as SMEE, which develops lithography machines, and AMEC, which develops etching machines, etc.
Geek Technology will also take out a large sum of money to invest in them, fully supporting them to accelerate the research and development of the next generation of chip production equipment.
Therefore, with the adjustment of Geek Technology's development strategy, the growth rate of domestic chips will increase again next.
It's just a pity that chips are the crown of human industrial manufacturing. To produce them, thousands of processes are required, as well as a large number of high-end core production equipment.
Among them, if any production equipment fails, it will eventually lead to the inability to produce chips.
Under such circumstances, the research and development of domestic chip production equipment and the promotion of process technology chips are not easy tasks, and it is not just a matter of having money.
Moreover, what's even worse is that there are too many chip production equipment. Even if Gao Nian participates in the research and development, he alone cannot develop so many things at the same time.
Therefore, the iteration and upgrade speed of process technology, even if you spend more money, it must follow common sense, and there is no way to achieve your own one-year research and development speed comparable to others' two or three years.
Therefore, the backwardness of chip process technology is almost long-term. If you want to truly catch up with the process technology of the United States, it will take at least four or five years.
After all, when China is developing the next generation of process technology, others are also developing the next generation of process technology. They will not wait for China.
Therefore, even if you try your best to catch up, it will take at least four or five years to catch up with Western process technology.
In these at least four or five years, the only magic weapon that Geek Technology can use to continue to maintain the mid-to-high-end product positioning of its chips is 3D chip stacking technology.
Only it can allow Geek Technology to use backward process technology to compete with or even surpass Western advanced process technology.
And these are not known to the outside world. They do not know that Geek Technology is about to launch a far-reaching super black technology research and development project.
It can be said that once this technology is completed, the global chip pattern will undergo major changes.
At that time, simply competing on process technology will be useless.
Because chips have become 3D structures, all of which have two or even multiple layers of transistors, it is naturally not very accurate to simply talk about the process technology's transistor spacing limit.
Therefore, if Geek Technology's 3D chip stacking technology can be born, then what will be competed for in the future will be the number of transistors!
Of course, Geek Technology's development strategy is not known to the outside world.
At this time, some companies are in a frenzy, cheering for the US Department of Commerce's antitrust investigation into Geek Technology.
United States, Silicon Valley, in a hotel.
"Ding! Ding! Ding! Ding!"
At this time, in the large private room of the hotel, several presidents happily raised their glasses of red wine.
